Design productivity is one the most important challenge facing future generation multiprocessor system on chip (MPSOC). The modeling of dozens of interconnected IPs with distributed memories implies ...
Interconnect mechanisms are application-specific and represent a significant part of a design's value. Being able to capture system-level processor interactions is key to validating your system. You ...
It’s often tempting to make one processor handle the entire system load. But sometimes adding a second processor is the best option. DESIGN VIEW is the summary of the complete DESIGN SOLUTION ...
In this paper, we describe the design flow, architecture and implementation of our 3D multiprocessor with NoC. The design based on 16 processors communicating using a 4x2x2 mesh NoC spread on two ...
Those days have long gone. There is currently a tremendous growth in the development of systems that involve tens or hundreds of complex processors and hardware accelerators in closely coupled or ...
Multiprocessor systems based on combinations of FPGAs and DSPs can be optimised with a design flow to address the creation, debug, verification and implementation of complex applications running ...
Two processors can work better than one when they're tuned to a particular application area. Tensilica's new Xtensa-V architecture makes this possible for any number ...
Providing the multiple unrelated clocks of today's multiprocessor FPGA/SoC designs presents a complex challenge to designers; user-programmable clock ICs with independent output frequencies and ...
Heterogeneous multiprocessor (HMP) systems, using functionally asymmetric compute elements, such as application processors and microcontrollers integrated within the same SoCs, are now used ...
IMEC has launched a suite of tools and methods designed to optimise the mapping of applications onto embedded multiprocessor SoCs. Although such devices have begun to appear in a number of ...
Multiprocessing is ubiquitous in today’s electronic systems. The key benefits are faster processing due to parallel execution and improved operating characteristics such as power, thermal and latency ...